Printed-circuit board and method of manufacture thereof
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United States of America Patent
Stats
-
Oct 26, 2004
Grant Date -
Jun 7, 2001
app pub date -
Dec 19, 2000
filing date -
Jul 22, 1998
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
A printed circuit board 1 providing superior adhesion between a substrate 2 and a conductor pattern 3 and preventing damage of the substrate 2. The width c of the bottom surface 310 of the conductor pattern 3 is greater than the width d of the top surface 320. Accordingly, the conductor pattern 3 has a trapezoidal cross-section. The two side surfaces 315 of a lower portion 31 of the conductor pattern 3 are coated by a solder resist. The two side surfaces 325 at the upper portion 32 of the conductor pattern 3 are exposed from the solder resist 4. A solder ball 6 engages the two side surfaces 325.
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