Test chip for evaluating fillers of molding material with dams formed on a semiconductor substrate to define slits for capturing the fillers
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United States of America Patent
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Apr 30, 2002
Grant Date -
Jun 7, 2001
app pub date -
Dec 1, 2000
filing date -
Dec 6, 1999
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A test chip for a molding material including fillers, including, a semiconductor substrate and a test circuit formed on the substrate. The test circuit includes at least one transistor, and two dams formed on the substrate for providing a slit therebetween, the slit capturing the fillers of the molding material when the molding material is applied to the test circuit. A method for testing a molding material including fillers for a semiconductor device, including steps of preparing a test chip, placing the test chip in molding equipment, injecting the molding material including fillers into the molding equipment, capturing the fillers in the slit, and detecting the influence of the fillers on electrical characteristics of the test chip using the test circuit.
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