Method for producing a metal layer with a given thickness
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United States of America Patent
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-
Oct 16, 2001
Grant Date -
Jun 7, 2001
app pub date -
Dec 4, 2000
filing date -
Dec 2, 1999
priority date (Note) -
In Force
status (Latency Note)
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Abstract
A method for producing a metal layer with a given thickness includes the step of measuring an electrical resistance of the metal layer via connections on a starting layer provided under the metal layer. The resistance measurement is performed during or after the deposition of the metal layer. The layer thickness of the deposited metal layer is determined from the resistance measurement. Depending on the thickness of the already deposited metal layer, the deposition process is continued or repeated until a metal layer with a desired thickness is produced.
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