MICA TAPE SPLICE AND METHOD OF FORMING THE SAME
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United States of America Patent
Stats
-
N/A
Issued Date -
Jun 14, 2001
app pub date -
Feb 19, 1998
filing date -
Feb 19, 1998
priority date (Note) -
Abandoned
status (Latency Note)
Importance
Abstract
A splice and a method of making the same. The splice is formed to join together first and second pieces of mica tape having a mica layer bonded to a first surface of a carrier layer. The mica layer from a portion of the first piece is removed so as to expose the first surface of the carrier layer. A thermoplastic film is disposed on the exposed first surface of the carrier layer of the first piece. A second surface of the carrier layer of the second piece is disposed on the bonding film so as to form an overlap area of the first and second pieces. Pressure and heat are applied to the overlap area to form the splice therein.
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