CMP slurry recycling apparatus and method for recycling CMP slurry
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Jul 2, 2002
Grant Date -
Jun 14, 2001
app pub date -
Dec 6, 2000
filing date -
Dec 10, 1999
priority date (Note) -
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status (Latency Note)
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Abstract
A polishing table 11 in the CMP apparatus 10 has a diameter smaller than the diameter of a polishing pad 12. The polishing pad 12 is disposed on the polishing table so as to cover the entire top surface of the polishing table 11. A space 13 is formed between outside of the outer peripheral surface of the polishing table 11 and under the outer peripheral bottom surface portion of the polishing pad 12 projecting outside from the edge of the polishing table 11. A trough 14 with an opening 14a on top thereof as a device for withdrawing the used slurry is disposed around the outer peripheral surface of the polishing table 11 so as to be located a part thereof in the space 13.
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