Photo curable resin composition and photosensitive element
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United States of America Patent
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Jun 24, 2003
Grant Date -
Jun 14, 2001
app pub date -
Nov 24, 1998
filing date -
Nov 28, 1997
priority date (Note) -
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Abstract
A photo curable resin composition, which comprises (A) an acid-modified, vinyl group-containing epoxy resin, (B) an elastomer, (C) a photopolymerization initiator, (D) a diluent and (E) a curing agent, can gives a high performance cured film having distinguished heat resistance, humidity-heat resistance, adhesibility, mechanical characteristics and electrical characteristics, and a photosensitive element, which comprises a support and a layer of the photo curable resin composition laid on the support, has distinguished heat resistance, humidity-heat resistance, adhesibility, mechanical characteristics and electrical characteristics.
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