Semiconductor package and manufacturing method thereof
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
N/A
Issued Date -
Jun 21, 2001
app pub date -
Dec 11, 2000
filing date -
Dec 10, 1999
priority date (Note) -
Abandoned
status (Latency Note)
Importance
Abstract
Embodiments of a semiconductor package and manufacturing methods therefor are disclose. An exemplary package comprises an optical semiconductor chip having input and output pads on an upper surface thereof. A transparent plate is bonded to the chip via a dam located within the input and output pads. The chip is mounted within an aperture through a planar circuit board. Wires electrically connect the input and output pads to circuit patterns of the circuit board. An encapsulant fills the aperture, and supports the chip therein. Interconnects are formed on the lower surface of the circuit board. An alternative embodiment omits the dam and the wires and employs a flip chip style connection between the chip and circuit patterns on the transparent plate. The transparent is supported by and attached to the upper surface of the planar circuit board.
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