Aluminum or aluminum alloy sputtering target and method for manufacturing the same
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United States of America Patent
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app pub date -
Jan 30, 2001
filing date -
Feb 23, 1998
priority date (Note) -
Abandoned
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Abstract
The sputtering target is manufactured by adjusting the ratio of the gas flow volume (Nm.sup.3)/molten liquid flow mass (kg) to 5 Nm.sup.3/kg or more in the gas atomizing step of the spray forming method using an Al or Al alloy sputtering target material in which the maximum length of all the inclusions is 20 .mu.m or less.
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