Double-sided circuit board and multilayer wiring board comprising the same and process for producing double-sided circuit board
Number of patents in Portfolio can not be more than 2000
United States of America Patent
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-
Apr 16, 2002
Grant Date -
Jun 28, 2001
app pub date -
Dec 14, 2000
filing date -
Dec 14, 1999
priority date (Note) -
Expired
status (Latency Note)
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Abstract
A double-sided circuit board of which a solder conductor is prevented from deformation in a cycling test so as to maintain high connection reliability, comprises an insulating layer 2 made of an organic high molecular weight resin and a circuit 3 provided on each side of the insulating layer 2, the circuits 3 on both sides being electrically connected through via-holes filled with a conductor 4 made of solder having a metal powder 6 dispersed therein.
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