Importance

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Abstract

An IC-card manufacturing apparatus includes paired press platens and a laminated-substrate sandwiching unit. Each of the press platens has a pressure-application surface. The laminated-substrate sandwiching unit includes upper and lower sandwiching members for sandwiching a laminated substrate in a sealed state. Each of the upper and lower sandwiching members has a plate portion equal in size and shape with the corresponding pressure-application surface or projecting outward from the pressure-application surface by a predetermined amount, a frame portion bigger than the plate portion, and a connection portion which connects the plate portion and the frame portion and absorbs thermal deformation of the plate portion. The IC-card manufacturing apparatus further includes an air supply unit for supplying air to air passages having air jetting openings formed on the pressure-application surfaces of the press platens, and a control unit for controlling the air supply unit so as to supply air to the air passages for a preset period of time when the paired press platens are opened. A plurality of air cushion units are disposed between a press-platen main body and a press-platen base to be located at different positions, and a pressure setting unit for independently controlling the respective pressures of the air cushion units is provided.

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First Claim