US Patent Application No: 2001/0006,251

Number of patents in Portfolio can not be more than 2000

Semiconductor device and manufacturing method

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Importance

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Abstract

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A semiconductor device comprising: a tape substrate which supports a semiconductor chip, said chip having surface electrodes, said tape substrate being provided with a plurality of leads corresponding to the surface electrodes of the semiconductor chip and bonded thereto, and with dummy leads formed in vacant regions in corner portions of the tape substrate where the leads are not formed; conductive members for bonding the surface electrodes of the semiconductor chip to the leads of the tape substrate; and a plurality of external terminals arranged on an outside periphery of the semiconductor chip and mounted on the tape substrate.

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Patent Owner(s)

Patent OwnerAddressTotal Patents
HITACHI ULSI SYSTEMS CO., LTD.TOKYO291
RENESAS TECHNOLOGY CORP.TOKYO657

International Classification(s)

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Hagiwara, Yasuhisa Higashiyamato, JP 7 7
Ichihara, Seiichi Hino, JP 25 176
Miyaki, Yoshinori Musashimurayama, JP 63 541
Nakamura, Hisao Yokohama, JP 55 181
Suzuki, Hidenori Atami, JP 120 733

Patent Citation Ranking

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Patent Info (Count) # Cites Year
 
MICRON TECHNOLOGY, INC. (4)
7,323,767 Standoffs for centralizing internals in packaging process 14 2002
7,462,510 Standoffs for centralizing internals in packaging process 2 2004
7,459,797 Standoffs for centralizing internals in packaging process 4 2004
7,501,309 Standoffs for centralizing internals in packaging process 0 2006
 
INTEL MOBILE COMMUNICATIONS GMBH (2)
7,911,068 Component and method for producing a component 1 2006
8,742,563 Component and method for producing a component 0 2010