Semiconductor device and manufacturing method

Number of patents in Portfolio can not be more than 2000

United States of America Patent

APP PUB NO 20010006251A1
SERIAL NO

09741899

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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A semiconductor device comprising: a tape substrate which supports a semiconductor chip, said chip having surface electrodes, said tape substrate being provided with a plurality of leads corresponding to the surface electrodes of the semiconductor chip and bonded thereto, and with dummy leads formed in vacant regions in corner portions of the tape substrate where the leads are not formed; conductive members for bonding the surface electrodes of the semiconductor chip to the leads of the tape substrate; and a plurality of external terminals arranged on an outside periphery of the semiconductor chip and mounted on the tape substrate.

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Patent Owner(s)

Patent OwnerAddressTotal Patents
HITACHI ULSI SYSTEMS CO., LTD.TOKYO81
RENESAS TECHNOLOGY CORP.TOKYO57

International Classification(s)

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Hagiwara, Yasuhisa Higashiyamato, JP 5 7
Ichihara, Seiichi Hino, JP 19 207
Miyaki, Yoshinori Tachikawa, JP 39 462
Nakamura, Hisao Akinuno, JP 52 245
Suzuki, Hidenori Kodaira, JP 92 1187

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Patent Citation Ranking

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Patent Info (Count) # Cites Year
 
MICRON TECHNOLOGY, INC. (8)
7323767 Standoffs for centralizing internals in packaging process 61 2002
* 2003/0201,525 Standoffs for centralizing internals in packaging process 2 2002
7462510 Standoffs for centralizing internals in packaging process 3 2004
7459797 Standoffs for centralizing internals in packaging process 5 2004
* 2005/0023,562 Standoffs for centralizing internals in packaging process 0 2004
* 2006/0237,832 Standoffs for centralizing internals in packaging process 2 2006
* 2006/0250,139 Bond pad structure comprising multiple bond pads with metal overlap 2 2006
7501309 Standoffs for centralizing internals in packaging process 0 2006
 
INTEL DEUTSCHLAND GMBH (2)
* 7911068 Component and method for producing a component 5 2006
8742563 Component and method for producing a component 0 2010
* Cited By Examiner