US Patent Application No: 2001/0006,251

Number of patents in Portfolio can not be more than 2000

Semiconductor device and manufacturing method

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Abstract

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A semiconductor device comprising: a tape substrate which supports a semiconductor chip, said chip having surface electrodes, said tape substrate being provided with a plurality of leads corresponding to the surface electrodes of the semiconductor chip and bonded thereto, and with dummy leads formed in vacant regions in corner portions of the tape substrate where the leads are not formed; conductive members for bonding the surface electrodes of the semiconductor chip to the leads of the tape substrate; and a plurality of external terminals arranged on an outside periphery of the semiconductor chip and mounted on the tape substrate.

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Patent Owner(s)

Patent OwnerAddressTotal Patents
HITACHI ULSI SYSTEMS CO., LTD.TOKYO92
RENESAS TECHNOLOGY CORP.TOKYO70

International Classification(s)

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Hagiwara, Yasuhisa Higashiyamato, JP 5 7
Ichihara, Seiichi Hino, JP 19 199
Miyaki, Yoshinori Tachikawa, JP 39 444
Nakamura, Hisao Akinuno, JP 52 220
Suzuki, Hidenori Kodaira, JP 92 1077

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Patent Citation Ranking

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Patent Info (Count) # Cites Year
 
MICRON TECHNOLOGY, INC. (8)
7,323,767 Standoffs for centralizing internals in packaging process 46 2002
* 2003/0201,525 Standoffs for centralizing internals in packaging process 1 2002
7,462,510 Standoffs for centralizing internals in packaging process 3 2004
7,459,797 Standoffs for centralizing internals in packaging process 5 2004
* 2005/0023,562 Standoffs for centralizing internals in packaging process 0 2004
* 2006/0237,832 Standoffs for centralizing internals in packaging process 2 2006
* 2006/0250,139 Bond pad structure comprising multiple bond pads with metal overlap 2 2006
7,501,309 Standoffs for centralizing internals in packaging process 0 2006
 
INTEL DEUTSCHLAND GMBH (2)
* 7,911,068 Component and method for producing a component 5 2006
8,742,563 Component and method for producing a component 0 2010
* Cited By Examiner