Semiconductor device and manufacturing method
Number of patents in Portfolio can not be more than 2000
United States of America Patent
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-
N/A
Issued Date -
Jul 5, 2001
app pub date -
Dec 22, 2000
filing date -
Dec 24, 1999
priority date (Note) -
Abandoned
status (Latency Note)
Importance
Abstract
A semiconductor device comprising: a tape substrate which supports a semiconductor chip, said chip having surface electrodes, said tape substrate being provided with a plurality of leads corresponding to the surface electrodes of the semiconductor chip and bonded thereto, and with dummy leads formed in vacant regions in corner portions of the tape substrate where the leads are not formed; conductive members for bonding the surface electrodes of the semiconductor chip to the leads of the tape substrate; and a plurality of external terminals arranged on an outside periphery of the semiconductor chip and mounted on the tape substrate.
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