Printed-circuit board and method of mounting electric components thereon
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
N/A
Issued Date -
Jul 5, 2001
app pub date -
Dec 15, 2000
filing date -
Dec 27, 1999
priority date (Note) -
Abandoned
status (Latency Note)
Importance
Abstract
It is an object of the invention is to reduce intervals between electric components mounted on a printed-circuit board by mounting the electric components on recessed portions formed on the printed-circuit board. It is another object of the invention to render an inductance as an electric property small by reducing the lengths of conductive patterns. To achieve these objects, bypass capacitors are mounted on the recessed portions that are formed by cutting one surface of the printed-circuit board, and an IC socket is mounted on one surface of the printed-circuit board, then the conductive patterns for connecting the IC socket 1 and metallic portions formed on both sides of the bypass capacitors are formed on one surface of the printed-circuit board.
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