IC package and method of making the same
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
N/A
Issued Date -
Jul 12, 2001
app pub date -
Jan 3, 2001
filing date -
Jan 6, 2000
priority date (Note) -
Abandoned
status (Latency Note)
Importance
Abstract
An exposed I/O terminal is disposed on a side of an IC package according to the present invention. This IC package includes an IC chip mounting substrate, an IC chip mounted on the IC chip mounting substrate, and an encapsulating member for encapsulating the IC chip. On a side of the chip mounting substrate is formed a trench for exposing the conductor that forms at least a portion of the I/O terminal, and one end of this trench is closed by a cap member, and the encapsulating member covers the IC chip and cap member. Ceramic material may be used as a material for the chip mounting substrate and cap member. Alternatively, the chip mounting substrate may be comprised of a printed wiring board, while the cap member may be formed of a solder resist film.
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