FINE PITCH ANISOTROPIC CONDUCTIVE ADHESIVE
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United States of America Patent
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Issued Date -
Jul 19, 2001
app pub date -
Jun 30, 1998
filing date -
Jun 30, 1998
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
Disclosed is an anisotropic conductive adhesive having an adhesive layer and conductive particles individually adhered to the adhesive layer, the conductive particles being arranged in an ordered array. The size of the conductive particles is at least somewhat smaller than the thickness of the adhesive layer. Also disclosed is an anisotropic conductive adhesive having an adhesive layer, conductive particles individually adhered to the adhesive layer, and a release liner having an ordered array of dimples. The conductive particles reside in a single layer in the dimples. The anisotropic conductive adhesive is made by placing the conductive particles in an ordered array of dimples on a low adhesion surface. An adhesive layer is then laminated on top such that the conductive particles individually adhere to the adhesive layer. The anisotropic conductive adhesive may be used to electrically connect fine pitch electrodes on opposing circuit layers.
First Claim
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- 15 United States
- 10 France
- 8 Japan
- 7 China
- 5 Korea
- 2 Other
Patent Owner(s)
Patent Owner | Address | |
---|---|---|
3M INNOVATIVE PROPERTIES COMPANY | P O BOX 33427 SAINT PAUL MN 55133-3427 |
International Classification(s)
Inventor(s)
Inventor Name | Address | # of filed Patents | Total Citations |
---|---|---|---|
CARPENTER, BERRY S | OAKDALE, MN | 1 | 19 |
CONNELL, GLEN | PINE SPRINGS, MN | 11 | 352 |
HOGERTON, PETER B | WHITE BEAR LAKE, MN | 14 | 795 |
YAMAGUCHI, HIROAKI H | TOKYO, JP | 1 | 19 |
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Fee | Large entity fee | small entity fee | micro entity fee |
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Surcharge after expiration - Late payment is unavoidable | $700.00 | $350.00 | $175.00 |
Surcharge after expiration - Late payment is unintentional | $1,640.00 | $820.00 | $410.00 |
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