Method of manufacturing electronic components
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United States of America Patent
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Aug 20, 2002
Grant Date -
Jul 19, 2001
app pub date -
Jul 30, 1998
filing date -
Jul 30, 1998
priority date (Note) -
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status (Latency Note)
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Abstract
A method of manufacturing electronic components includes disposing a top metal layer (502) comprised of solder over a bottom metal layer (201, 202) comprised of titanium or tungsten, and selectively etching the bottom metal layer (201, 202) over the top metal layer (502) with an etchant mixture (601) comprised of an etchant, an additive to control the temperature of the etchant mixture (601), and another additive to reduce the redeposition of the top layer (502).
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