Manufacturing method of printed circuit board
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United States of America Patent
Stats
-
Sep 4, 2001
Grant Date -
Jul 19, 2001
app pub date -
Dec 15, 1999
filing date -
Dec 25, 1998
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
In a manufacturing method of a printed circuit board comprising a process of coating insulative thermosetting resin on a surface of a printed circuit board having a blind hole and a process of filling up the insulative thermosetting resin in the blind hole, the printed circuit board coated with the insulative thermosetting resin is kept in a low pressure atmosphere of 1.3 to 666 hPa, and then the insulative thermosetting resin is hardened, so that the insulative thermosetting resin is filled up in the blind hole appropriately.
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