Corrosion inhibitor of NiCu for high performance writers
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United States of America Patent
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-
May 14, 2002
Grant Date -
Jul 19, 2001
app pub date -
Jan 8, 2001
filing date -
Jan 18, 2000
priority date (Note) -
Expired
status (Latency Note)
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Abstract
The problem of copper corrosion that occurs in the presence of strong alkaline developing solutions during photo rework has been overcome by protecting all exposed copper bearing surfaces from attack. Two ways of achieving this are described. In the first method, benzotriazole (BTA) is added to the developing solution which is then used in the normal way, developing time being unaffected by this modification. In the second method, the surface that is to receive the photoresist is first given a dip in a solution of BTA, following which the photoresist is immediately applied and processing, including development, proceeds as normal. For both methods the result is the elimination of all copper corrosion during development.
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