Method of forming metal layer(s) and/or antireflective coating layer(s) on an integrated circuit
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United States of America Patent
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Mar 18, 2003
Grant Date -
Jul 19, 2001
app pub date -
Jan 12, 2001
filing date -
Jun 17, 1998
priority date (Note) -
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Abstract
A method of forming metallic layers on a substrate includes the steps of forming a first layer including a first metal on the substrate; cooling the first layer for a period of time sufficient to suppress formation of an intermetallic phase; and forming a second layer including a second metal distinct from the first metal on the first layer. The cooling step decreases the roughness of the resultant stacked structure by suppressing the formation of an intermetallic phase layer between the two metallic layers and by suppressing 'bumps' or other surface irregularities that may form at relatively reactive grain boundaries in the first layer.
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