Structure having multiple levels of programmable integrated circuits for interconnecting electronic components
Number of patents in Portfolio can not be more than 2000
United States of America Patent
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N/A
Issued Date -
N/A
app pub date -
Feb 28, 2001
filing date -
Sep 20, 1989
priority date (Note) -
Abandoned
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Abstract
A field programmable printed circuit board is provided which includes a multiplicity of component contacts for making electrical contact to the leads of electronic components to be mounted on the printed circuit board, a corresponding multiplicity of interconnect contacts for receipt of the leads on the package or packages of a programmable integrated circuit or circuits for interconnecting as desired the electronic components, and one or more layers of conductive traces formed on the printed circuit board, each conductive trace uniquely connecting electrically one component contact to one interconnect contact.
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