US Patent Application No: 2001/0009,724

Number of patents in Portfolio can not be more than 2000

Method of making a product with improved material properties by moderate heat treatment of a metal incorporating a dilute additive

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Abstract

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Deposition of metal in a preferred shape, including coatings on parts, or stand-alone materials, and subsequent heat treatment to provide improved mechanical properties. In particular, the method gives products with relatively high yield strength. The products often have relatively high elastic modulus, and are thermally stable, maintaining the high yield strength at temperatures considerably above 25.degree. C. This technique involves depositing a material in the presence of a selected additive, and then subjecting the deposited material to a moderate heat treatment. This moderate heat treatment differs from other commonly employed 'stress relief' heat treatments in using lower temperatures and/or shorter times, preferably just enough to reorganize the material to the new, desired form. Coating and heat treating a spring-shaped substrate provides a resilient, conductive contact useful for electronic applications.

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Patent Owner(s)

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International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Chen, Jimmy Kuo-Wei Pleasanton, CA 3 130
Dozier, Thomas H Carrolton, TX 12 710
Eldridge, Benjamin N Danville, CA 402 10377
Herman, Gayle J Danville, CA 2 113
Yeh, Junjye J Livermore, CA 2 113

Patent Citation Ranking

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Patent Info (Count) # Cites Year
 
ADVANTEST (SINGAPORE) PTE LTD (9)
7,137,830 Miniaturized contact spring 6 2003
7,126,220 Miniaturized contact spring 8 2003
7,349,223 Enhanced compliant probe card systems having improved planarity 20 2004
7,382,142 High density interconnect system having rapid fabrication cycle 9 2005
7,952,373 Construction structures and manufacturing processes for integrated circuit wafer probe card assemblies 2 2006
7,621,761 Systems for testing and packaging integrated circuits 14 2007
7,872,482 High density interconnect system having rapid fabrication cycle 0 2007
7,772,860 Massively parallel interface for electronic circuit 0 2008
7,884,634 High density interconnect system having rapid fabrication cycle 0 2009
 
NANONEXUS CORPORATION (2)
7,579,848 High density interconnect system for IC packages and interconnect assemblies 26 2006
7,403,029 Massively parallel interface for electronic circuit 8 2006
 
INFINEON TECHNOLOGIES AG (1)
8,541,892 Bonding connection between a bonding wire and a power semiconductor chip 0 2010
 
MICRON TECHNOLOGY, INC. (1)
7,094,117 Electrical contacts with dielectric cores 1 2004
 
SUMITOMO ELECTRIC INDUSTRIES, LTD. (1)
8,052,810 Metal structure and fabrication method thereof 1 2009
 
TDK CORPORATION (1)
7,396,445 Method of manufacturing a thin-film magnetic head using a soft magnetic film having high saturation magnetic flux density 0 2004
 
TYCO ELECTRONICS CORPORATION (1)
7,147,729 Method and apparatus for induction heat treating electrical contacts 0 2002