Multilayer combined rigid/flex printed circuit board containing flexible soldermask
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United States of America Patent
Stats
-
Feb 26, 2002
Issued Date -
N/A
app pub date -
Mar 1, 1999
filing date -
Feb 14, 1997
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A multilayer rigid flex printed circuit board wherein the board laminate comprises a basestock composite containing a flexible core, formed by laminating a first conductive layer to a flexible insulator layer, a second insulator layer affixed to the basestock, said second insulator layer having a cutout region proximate to the flexible core of the basestock composite to expose a portion of said first conducting layer on said flexible core, a second conductive layer attached to said second insulator layer said second conductive layer having a cutout region proximate to the flexible core of the basestock composite, and a photo-imageable soldermask applied to the exposed portion said first conducting layer, and to the second conductive layer, wherein said photoimageable soldermask allows for photo definition of openings on the conductive layers to which it is applied.
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