Bubble-based micropump
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United States of America Patent
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app pub date -
Apr 3, 2001
filing date -
Jul 7, 1999
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
A micro-pump for pumping either electrically conductive or non-conductive liquids through channels of the micro-pump and/or micro-devices. A conductive or non-conductive liquid, depending on the specific application of the present invention, is disposed within a liquid chamber and/or channel of the micro-pump. An energy source is then applied to the micro-pump of the present invention in order to form one or more vapor bubbles within the channel. Thereafter the vapor bubble(s) is collapsed, and the process of forming and collapsing the vapor bubble may thereafter be repeated. By the formation and collapsing cycle of the vapor bubble, a pumping action of the liquid is effectuated thereby transporting the liquid within the micro-pump of the present invention and/or micro-devices.
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