Laser cleaning process for semiconductor material and the like
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United States of America Patent
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Dec 17, 2002
Issued Date -
N/A
app pub date -
Jan 23, 2001
filing date -
Mar 12, 1998
priority date (Note) -
Expired
status (Latency Note)
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Abstract
A laser cleaning process is disclosed for cleaning the surface of materials, such as semiconductor wafers and the like, which process can be performed at atmospheric pressure. The process includes the steps of providing a structure with a surface having undesirable contaminant particles thereon, wetting the surface with a liquid including reactive or non-reactive liquids, and irradiating the surface using photon energy with sufficient energy to remove the wetting liquid and the undesirable material.
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