SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE AND PACKAGE STRUCTURE FOR THE SAME
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United States of America Patent
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N/A
Issued Date -
Aug 9, 2001
app pub date -
Aug 20, 1998
filing date -
Sep 12, 1997
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
A semiconductor IC device 100 comprises an active area 102 including a plurality of unit cells 101a and 101b, and a plurality of electrodes 103 disposed in a zigzag fashion along the periphery of the active area 102. Signal I/O electrodes 103a are disposed on the first row of the zigzag electrode arrangement while the power supply and ground electrodes 103b and 103c are alternately disposed on the second row of the zigzag electrode arrangement. Owing to this constitution, power supply and ground electrode 103b and 103c may exist separately from signal I/O electrode 103a, so that a sufficient number of power supply and ground electrodes 103b and 103c can be secured even in the case that all of available signal I/O electrodes 103a are fully used for maximum operation of the circuit portion (active area) 102.
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