Importance

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Abstract

A pick-up device 10 sucks the air through a suction port 13, which is provided at the lower end of a capillary 12 and thereby picks up a solder ball H with the lower end of the capillary 12. Then, the pick-up device 10 transports the solder ball H to an electrical terminal of an electronic component IC and mounts it on the terminal. An air blower 20 is provided below the route which the pick-up device 10 takes for the transportation. During the transportation of the solder ball H, the capillary 12 of the pick-up device 10 is exposed to the air which is blown upward from the air blower 20, so the extra solder balls which have stuck to the periphery of the capillary 12 are blown off from the capillary 12. Because the direction of the air being blown is vertically upward, the solder ball H stuck in the suction port 13 of the capillary 12 is pushed to the suction port 13 and is firmly retained there.

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First Claim