STACKED MODULE CONNECTOR

Number of patents in Portfolio can not be more than 2000

United States of America Patent

APP PUB NO 20010012726A1
SERIAL NO

09417821

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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A connector suitable for providing an electrical connection between a plurality of modules with card edge connections and the motherboard in a stacked configuration is disclosed. This connector includes a plurality of housings, each containing a socket with contacts suitable for providing an electrical contact between a module and the motherboard. These housings are stacked in a direction normal to the surface on which the connector is mounted, such as the motherboard. These housings can also be offset with respect to each other such that the modules are secured to the connector in a stacked and stepped configuration.

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Patent Owner(s)

Patent OwnerAddressTotal Patents
Dell USA, L.P.ROUND ROCK, TX781

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
LIAO, REYNOLD L AUSTIN, TX 19 287
O'NEAL, SEAN P ROUND ROCK, TX 36 396
SWAMY, DEEPAK AUSTIN, TX 14 368

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Patent Citation Ranking

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Patent Info (Count) # Cites Year
 
TE CONNECTIVITY CORPORATION (2)
* 8562374 Harness connector 1 2011
* 2012/0270,433 HARNESS CONNECTOR 3 2011
 
VIA TECHNOLOGIES, INC. (2)
* 7007175 Motherboard with reduced power consumption 101 2001
* 2002/0144,166 Motherboard with reduced power consumption 5 2001
 
Liantec Systems Corporation. (1)
* 2008/0022,028 Interface card and a computer motherboard which are used in a horizontal adaptation 2 2006
 
Aehr Test Systems (2)
* 8986048 Integrated feedthrough module 0 2011
* 2011/0256,774 SEPARATE TEST ELECTRONICS AND BLOWER MODULES IN AN APPARATUS FOR TESTING AN INTEGRATED CIRCUIT 0 2011
 
HUAWEI TECHNOLOGIES CO., LTD. (2)
* 8570764 Backplane and backplane communication system 0 2011
* 2012/0002,378 BACKPLANE AND BACKPLANE COMMUNICATION SYSTEM 1 2011
* Cited By Examiner