Resist film removing composition and method for manufacturing thin film circuit element using the composition

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 6500270
APP PUB NO 20010013502A1
SERIAL NO

09176523

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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A resist film removing composition used in the manufacture of a thin film circuit element having an organic insulation film which comprises 50 to 70% by weight of an alkanolamine having 3 or more carbon atoms, 20 to 30% by weight of a water-miscible solvent and 10 to 20% by weight of water. The resist film removing composition can easily remove a resist film remaining after etching, without swelling the organic insulation film.

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Patent Owner(s)

  • MITSUBISHI GAS CHEMICAL COMPANY, INC.;SHARP CORPORATION

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Abe, Hisaki Niigata-ken, JP 9 275
Aoyama, Tetsuo Niigata-ken, JP 36 845
Karita, Tetsuya Niigata-ken, JP 4 61
Maruyama, Taketo Niigata-ken, JP 20 320
Nohara, Masahiro Mie-ken, JP 13 225
Oketani, Taimi Mie-ken, JP 17 112
Takeuchi, Yukihiko Mie-ken, JP 6 41

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