METHOD OF FABRICATING SEMICONDUCTOR PACKAGE
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United States of America Patent
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May 21, 2002
Grant Date -
Aug 23, 2001
app pub date -
Feb 17, 1998
filing date -
Feb 26, 1997
priority date (Note) -
Granted
status (Latency Note)
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Abstract
A method of fabricating a semiconductor package is provided, which realizes a small-size semiconductor package without performance deterioration, to meet a tendency to miniaturization of electronic products in which semiconductor packages are mounted, such as communication apparatus and computer, provides a new type of compact multi-pin semiconductor package as large as a semiconductor chip mounted thereon, and accomplishes a semiconductor package having multi-function to minimize its mounting area on an electronic product, resulting in minimizing of the products.
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