Test structure for metal CMP process control
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United States of America Patent
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Issued Date -
Aug 23, 2001
app pub date -
Feb 20, 2001
filing date -
Feb 20, 2000
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
A test structure is presented to be formed on a patterned structure and to be used for controlling a CMP process applied to the patterned structure, which has a pattern area formed by spaced-apart metal-containing regions representative of real features of the patterned structure. The test structure thus undergoes the same CMP processing as the pattern area. The test structure comprises at least one pattern zone in the form of a metal area with at least one region included in the metal area and made of a material relatively transparent with respect to incident light, as compared to that of the metal.
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