Method of making wafer level chip scale package
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United States of America Patent
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-
Jul 16, 2002
Grant Date -
Aug 23, 2001
app pub date -
Feb 20, 2001
filing date -
Feb 21, 2000
priority date (Note) -
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status (Latency Note)
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Abstract
A method for fabricating the wafer level chip scale package (WLCSP) is developed. This method mainly comprises the steps of: disposing a wafer on the top surface of a retractable film, the wafer having a plurality of chips and a plurality of cutting lines therebetween, each chip having a plurality of bonding pads; cutting the wafer into individual chips along the cutting lines; stretching the retractable film so as to separate the cut chips from one another with a predetermined distance; molding the cut wafer in order to encapsulate the bonding pads and sides of each chip completely; grinding the encapsulated chip to expose the bonding pads out of the molding compound; and sawing the encapsulated chips into individual semiconductor package unit.
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