Semiconductor device, substrate for mounting semiconductor chip, processes for their production, adhesive, and double-sided adhesive film
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United States of America Patent
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Sep 16, 2003
Grant Date -
Sep 20, 2001
app pub date -
Apr 26, 2001
filing date -
Oct 8, 1996
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Abstract
The present invention aims at an improvement in temperature-cycle resistance after packaging in semiconductor devices and also an improvement in moisture-absorbed reflow resistance, and provides an adhesive having a storage elastic modulus at 25.degree. C. of from 10 to 2,000 MPa and a storage elastic modulus at 260.degree. C. of from 3 to 50 MPa as measured with a dynamic viscoelastic spectrometer, and also a double-sided adhesive film, a semiconductor device and a semiconductor chip mounting substrate which make use of the adhesive, and their production process.
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