Process and apparatus for heat-treating substrate having film-forming composition thereon
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United States of America Patent
Stats
-
May 7, 2002
Grant Date -
Sep 20, 2001
app pub date -
May 22, 2001
filing date -
Oct 26, 1995
priority date (Note) -
Expired
status (Latency Note)
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Abstract
Firing process and apparatus for uniformly heat-treating a substrate having a film-forming composition thereon, wherein the substrate is subjected to a first soaking step in which the substrate is held for a predetermined time in a first heating chamber whose temperature is maintained at a first value, so that the temperature within the substrate is held at the first value evenly throughout an entire mass of the substrate, and after feeding of the substrate into a second heating chamber whose temperature is maintained at a predetermined second value which is different from the first value by a predetermined difference, the substrate is subjected to a second soaking step in which the substrate is held for a second predetermined time in the second heating chamber, so that the temperature within the substrate is held at the second value evenly throughout the entire mass of the substrate.
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