Absorbent pad
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United States of America Patent
Stats
-
N/A
Issued Date -
Sep 20, 2001
app pub date -
Apr 13, 2001
filing date -
Nov 13, 1995
priority date (Note) -
Abandoned
status (Latency Note)
Importance
Abstract
An absorbent pad formed having an upper film layer of a heat resistant porous material: a lower film layer of a heat resistant, non-absorbent, non-porous material, the lower film being bonded to the upper film layer along at least two of their respective opposing peripheral edges and an intermediate absorbent layer of liquid absorbent material between the upper film layer and lower film layer having the absorbent material at least partially bonded to the inside surface of at least one of the upper film layer or lower film layer.
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