Implantable lead and method of manufacture
Number of patents in Portfolio can not be more than 2000
United States of America Patent
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Issued Date -
N/A
app pub date -
Jan 12, 2001
filing date -
Apr 26, 1999
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
An implantable, substantially isodiametric, low resistance implantable lead having at least one electrode positioned in a stimulation/sensing portion of the lead as well as a method of manufacturing the same. At least the stimulation/sensing portion is unitized through partially surrounding and supporting insulation and conductive element(s) of the stimulation/sensing portion with a fused matrix of material having mechanical properties consistent with a body of the lead.
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