Plasma reactor for the treatment of large size substrates
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United States of America Patent
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app pub date -
Apr 3, 2001
filing date -
Aug 10, 1999
priority date (Note) -
Abandoned
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Abstract
A radiofrequency plasma reactor (1) for the treatment of substantially large sized substrates is disclosed, comprising between the electrodes (3, 5) of the plasma reactor a solid or gaseous dielectric layer (11) having a non planar-shaped surface-profile, said profile being defined for compensating a process non uniformity in the reactor or generating a given distribution profile.
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