Semiconductor package using terminals formed on a conductive layer of a circuit board
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Mar 15, 2005
Grant Date -
Sep 27, 2001
app pub date -
May 24, 2001
filing date -
Jun 11, 1998
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
A small package is provided for a flash EEPROM memory. The small package uses terminals which are part of a bottom conductive layer of a circuit board. In this manner, the final package can be quite thin. The circuit board can be connected to the integrated circuits and passive devices and can be encapsulated in plastic or glued to a plastic cover. In this manner, a thin and relatively inexpensive package can be formed. Additionally, the circuit board can have testing connections which can be removed before forming the final package.
First Claim
Family
International Classification(s)
Cited Art Landscape
Patent Citation Ranking
Advertisement
Advertisement
Advertisement
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully