Semiconductor devices
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Mar 23, 2004
Grant Date -
Sep 27, 2001
app pub date -
Feb 23, 2001
filing date -
Feb 28, 2000
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
In a semiconductor device, the likely occurrence of cracking of a ceramic substrate, and the consequential disconnection of internal layer wiring, due to thermal changes suffered when the semiconductor device is mounted on external wiring boards having different thermal expansion is prevented. The semiconductor device has a ceramic substrate, a wiring pattern formed on a first principal plane and having mounted semiconductor components, an external electrode portion formed on a second principal plane and connected to an external circuit, internal layer wiring formed inside said ceramic substrate to electrically connect said wiring pattern and said external electrode portion via through-hole wiring, and semiconductor components and a resin layer covering said semiconductor components, wherein the internal layer wiring is formed internally with respect to the side of said ceramic substrate with a clearance of at least 0.05 mm.
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