Semiconductor device, a semiconductor module loaded with said semiconductor device and a method of manufacturing said semiconductor device

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 6756661
APP PUB NO 20010026009A1
SERIAL NO

09800503

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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A memory TCP loaded with four chips (1-bank 16-bit type) is constructed by a tape of one two-layer wiring layer structure, four chips mounted to this tape, etc. Common signal terminals are arranged on one set of two opposed sides, and an independent signal terminal is arranged on another side. The common signal terminals on the two sides are electrically connected to each other common signal wiring. Further, in a DIMM in which this memory TCP is mounted to front and rear sides of a substrate, plural external terminals are formed on one long side of the rectangular substrate, and the memory TCP is mounted such that the independent signal terminal of the memory TCP is arranged along an arranging direction of these external terminals.

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Patent Owner(s)

Patent OwnerAddress
PS4 LUXCO S A R L208 VAL DES BONS MALADES LUXEMBOURG L-2121

International Classification(s)

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Nagaoka, Kouji Toubu, JP 3 184
Sato, Tomohiko Kokubunji, JP 69 742
Sugano, Toshio Kodaira, JP 69 2533
Tsukui, Seiichiro Sayama, JP 17 1224
Tsuneda, Kensuke Kokubunji, JP 8 300

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