Semiconductor device, a semiconductor module loaded with said semiconductor device and a method of manufacturing said semiconductor device
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Jun 29, 2004
Grant Date -
Oct 4, 2001
app pub date -
Mar 8, 2001
filing date -
Mar 24, 2000
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A memory TCP loaded with four chips (1-bank 16-bit type) is constructed by a tape of one two-layer wiring layer structure, four chips mounted to this tape, etc. Common signal terminals are arranged on one set of two opposed sides, and an independent signal terminal is arranged on another side. The common signal terminals on the two sides are electrically connected to each other common signal wiring. Further, in a DIMM in which this memory TCP is mounted to front and rear sides of a substrate, plural external terminals are formed on one long side of the rectangular substrate, and the memory TCP is mounted such that the independent signal terminal of the memory TCP is arranged along an arranging direction of these external terminals.
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