Conductive element and manufacturing method thereof
Number of patents in Portfolio can not be more than 2000
United States of America Patent
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-
May 27, 2003
Grant Date -
Oct 11, 2001
app pub date -
Feb 26, 2001
filing date -
Apr 5, 2000
priority date (Note) -
Expired
status (Latency Note)
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Abstract
A conductive element having good solderability and the manufacturing method thereof. A metal wire having a circular section and tin-plated along its whole circumference is prepared and pressed by a pressing machine from the side directions until the metal wire becomes almost flat. By this, a strip of thin plate-like member is formed. Then, a conductive silicone base adhesive is applied to one surface (one pressed surface) of the plate-like member and dried. Thus, the conductive element comprising the plate-like member and the conductive elastomer joined to the pressed surface thereof is obtained.
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