Abrasive dressing tool and method for manufacturing the tool
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United States of America Patent
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Jul 9, 2002
Grant Date -
Oct 25, 2001
app pub date -
Feb 9, 2001
filing date -
Feb 10, 2000
priority date (Note) -
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status (Latency Note)
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Abstract
The present invention relates to an abrasive dressing tool used for mechanical and chemical planarization abrasion of the surface of the work pieces as can be used for semiconductor wafers or the like which require precise, planar and micro polishing, and a method for manufacturing the same dressing tool. Specifically, ultimately macro- and micro-scratches on wafers can be drastically reduced, the rate of inferior finished products or wafers can be decreased and abrasive life time of the tool can be prolonged, by sintering and brazing abrasive particles with a nickel based brazing metal on the abrasive tool, and then filling or covering the non-sintered parts and re-crystallized parts of sintered and brazed layers, apt to crack or fall-out from the surface, through electroplating process.
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