Stackable flex circuit chip package and method of making same
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Jul 30, 2002
Grant Date -
Nov 1, 2001
app pub date -
Jun 25, 2001
filing date -
May 5, 1999
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
A stackable integrated circuit chip package having a flex circuit. The flex circuit itself includes a flexible substrate having opposed, generally planar top and bottom surfaces, and a conductive pattern which is disposed on the bottom surface. The chip package further includes a frame which is attached to the substrate of the flex circuit, and an integrated circuit chip which is at least partially circumvented by the frame and electrically connected to the conductive pattern. The substrate is wrapped about and attached to at least a portion of the frame such that the conductive pattern defines first and second portions which are each electrically connectable to another stackable integrated circuit chip package.
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