Imbedded die-scale interconnect for ultra-high speed digital communications
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United States of America Patent
Stats
-
Aug 6, 2002
Issued Date -
N/A
app pub date -
Jun 27, 2001
filing date -
Dec 30, 1998
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
A printed circuit board with an imbedded electrical component, comprising three layers. The first and second layers are coupled together, and an area of the second layer of the printed circuit board is selectively removed to expose a portion of the first layer of the printed circuit board. The opening accepts an electrical component that is mounted to the first layer of the printed circuit board within the selectively removed area of the second layer of the printed circuit board. The third layer of the printed circuit board is coupled to the second layer of the printed circuit board, at least partially covers the selectively removed area of the second layer of the printed circuit board, and at least partially covers the mounted component within the selectively removed area of the second layer of the printed circuit board.
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