Method for converting a reclaim wafer into a semiconductor wafer
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United States of America Patent
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N/A
Issued Date -
Nov 8, 2001
app pub date -
Feb 23, 2001
filing date -
Apr 13, 2000
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
A method to convert a reclaim wafer into a semiconductor wafer, suitable as starting material for semiconductor fabrication, with a front surface, a back surface and an edge. At least one of the two surfaces bearing foreign material which originates from at least one process for the fabrication of semiconductor components. The method includes the following individual steps: (a) material-removing machining of at least one foreign-material-bearing surface of the reclaim wafer; (b) removal of surface material from at least one of the surfaces and/or the edge of the reclaim wafer by means of at least one etching step; (c) polishing of the edge of the reclaim wafer; (d) simultaneous polishing of the surfaces of the reclaim wafer between rotating polishing plates; (e) single-side polishing of at least one surface of the reclaim wafer on a polishing plate.
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