Electronic device and method of producing the same

Number of patents in Portfolio can not be more than 2000

United States of America Patent

APP PUB NO 20010040793A1
SERIAL NO

09772985

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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An electronic device comprising plurality of chips mounted at a high density as in a multi-chip module and having a reduced area and a thinner shape, provided with a folded flexible board having flexibility, chips mounted on a surface of the flexible board, and an adhesive comprising an insulating material filled between facing surfaces of the folded board for sealing the chips and affixing the facing surfaces.

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Patent Owner(s)

Patent OwnerAddress
SONY CORPORATIONTOKYO JAPAN

International Classification(s)

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Inaba, Tetsuya Nagano, JP 12 163

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