Plasma deposition of spin chucks to reduce contamination of Silicon wafers
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United States of America Patent
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Oct 18, 2005
Issued Date -
N/A
app pub date -
Jun 4, 2001
filing date -
Mar 23, 1999
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Abstract
An apparatus for delivering a fluidic media to a wafer includes a housing defining a process chamber. A fluidic media delivery member is coupled to the process chamber. A rotatable chuck is positioned in the process chamber. The rotatable chuck has a wafer support surface coated with a coating material. A vacuum supply line is coupled to the rotatable chuck.
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