Molding of electrical devices with a thermally conductive and electrically insulative polymer composition
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
N/A
Issued Date -
Nov 29, 2001
app pub date -
Jan 31, 2001
filing date -
Feb 1, 2000
priority date (Note) -
Abandoned
status (Latency Note)
Importance
Abstract
The present invention provides an overmolded electronic device cover assembly and method of manufacturing the same. The device cover assembly is molded directly over an electronic device, such as a resistor or a capacitor, that requires both electrical isolation and effective cooling. The device cover assembly is overmolded about and in direct contact with the electronic device package and is formed from a thermally conductive and electrically insulative moldable polymer composition. The molded device cover assembly is positioned in thermal communication with at least the front side, the rear side, the left side, the right side and the top side of the electronic device package for cooling thereof while providing electrical isolation and sealing the device against the effects of dust and moisture infiltration. The direct molding of the device cover assembly to the heat generating device obviates the need for interface materials, adhesives and other assembly operations.
First Claim
Family
International Classification(s)
- [Classification Symbol]
- [Patents Count]
Cited Art Landscape
Patent Citation Ranking
Advertisement
Advertisement
Advertisement
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully