Apparatus and method for solder-sealing an active matrix organic light emitting diode
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United States of America Patent
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Aug 19, 2003
Grant Date -
Dec 6, 2001
app pub date -
Feb 8, 2001
filing date -
Feb 8, 2000
priority date (Note) -
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status (Latency Note)
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Abstract
The present invention is directed to an apparatus and method of solder-sealing an active matrix OLED display using a monochromatic solid-state laser beam (1). The solder-sealing apparatus comprises a cover assembly (13) adapted to be positioned over at least one OLED (11) on a substrate (10), a sealing band (12) surrounding each OLED, a chuck assembly (20) with an array of heat sinks (21) that align with the OLEDs, a pick-up assembly (30) with at least one aperture (33), and a flange assembly (132) to which a solder pre-form (133) is secured. The chuck assembly (20) receives, aligns and orients the substrate (10). A vacuum is then applied through each aperture (33) to align and hold the cover assembly (13) in place. The sealing band (12) and solder pre-form (133) are aligned and pressed together by the pick-up assembly (30), and the focused laser beam (1) is projected through the chuck assembly to seal the OLEDs (11) within the cover assembly (13).
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