Methods of treating preform elements
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United States of America Patent
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Feb 11, 2003
Issued Date -
N/A
app pub date -
Apr 6, 2001
filing date -
May 27, 1998
priority date (Note) -
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Abstract
A method of thermally treating a preform element, of the kind having a facing table of polycrystalline diamond bonded to a substrate of cemented tungsten carbide, comprises the steps of: (a) heating the element to a soaking temperature of 550-625.degree. C., and preferably about 600.degree. C., (b) maintaining the element at that temperature for at least one hour, and (c) cooling the element to ambient temperature. The resulting preform element has a substrate with a cobalt binder including a substrate interface zone with at least 30 percent by volume of the cobalt binder a hexagonal close packed crystal structure. This reduces the risk of cracking or delamination of the element in use.
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